NW-AI
Project: Energy-Efficient and Scalable AI HW Systems through Heterogeneous Integration of Specialized Chiplets (ScaleAI). Tech: AI/Hardware. Background:  In Year 1, the Scale AI project achieved a world-first milestone by fabricating a monolithic 3D chip in a U.S. foundry, integrating Si CMOS, Resistive RAM (RRAM), and Carbon Nanotube FETs (CNFETs) to deliver a 4x hardware throughput benefit. This breakthrough directly addresses the crit